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CYW55513IUBGT - Infineon

Description: IC RF TxRx + MCU 802.15.4 Bluetooth v5.4 2.4GHz ~ 6GHz 143-BGA, WLBGA

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PCB Footprints
CYW55513IUBGT - Infineon PCB footprint - BGA - BGA - 143-ball WLBGA 3.57 × 5.32 × 0.45 mm (0.35 mm ball pitch)
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3D Models
CYW55513IUBGT - Infineon  - 3D model - BGA - 143-ball WLBGA 3.57 × 5.32 × 0.45 mm (0.35 mm ball pitch)
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CYW55513IUBGT Details

  • Manufacturer Part Number:

    CYW55513IUBGT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Infineon Technologies AG

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

CYW55513IUBGT Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout and thermal management guide in their application note AN2151. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • Infineon provides a secure boot and firmware update guide in their application note AN2241. It covers the implementation of secure boot, firmware encryption, and secure firmware updates using the WICED Studio SDK.
  • The CYW55513 is designed for Wi-Fi 5 (802.11ac) and has limitations in terms of mesh network support. It's essential to consider the number of nodes, network topology, and traffic patterns when designing a Wi-Fi mesh network. Infineon provides guidance on mesh network implementation in their application note AN2271.
  • Infineon provides power consumption optimization guidelines in their application note AN2161. It covers techniques such as dynamic voltage and frequency scaling, power gating, and low power modes to achieve optimal power consumption.
  • The CYW55513 is a Wi-Fi module that requires certification and compliance with regulatory requirements such as FCC, CE, and TELEC. Infineon provides guidance on certification and regulatory requirements in their application note AN2231.

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