CZRU52C5V1-HF footprint, schematic symbol and 3D model by Comchip Technology

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CZRU52C5V1-HF Details

The recommended land pattern for the CZRU52C5V1-HF is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
The CZRU52C5V1-HF has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good airflow around the component, use a heat sink if necessary, and avoid overheating the component above 125°C.
The recommended soldering profile for the CZRU52C5V1-HF is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. Ensure that the component is not exposed to temperatures above 260°C.
To ensure the reliability of the CZRU52C5V1-HF in high-vibration environments, use a secure mounting method such as screwing or adhesive bonding, and ensure that the component is properly secured to the PCB.
The recommended storage condition for the CZRU52C5V1-HF is in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%.

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