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D1230N18T - Infineon

Description: Rectifiers Rectifier Diode 1230A 1800V

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D1230N18T - Infineon  - 3D model
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D1230N18T Details

  • Manufacturer Part Number:

    D1230N18T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Hungary

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.77 V

  • JESD-30 Code:

    O-CEDB-N2

  • Non-rep Pk Forward Current-Max:

    11800 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    180 °C

  • Output Current-Max:

    1230 A

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Shape:

    ROUND

  • Package Style:

    DISK BUTTON

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1800 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    END

D1230N18T Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and spacing to ensure optimal heat dissipation.
  • Infineon recommends using a gate driver with a peak current capability of at least 10A and a voltage rating of 15V to 20V. The driver should also have a low propagation delay and a high common-mode rejection ratio (CMRR) to ensure reliable operation.
  • The maximum allowed overcurrent is typically 2-3 times the rated current. To protect the device, use a fast-acting fuse or a current-sensing circuit with a shutdown mechanism to prevent damage from overcurrent conditions.
  • Follow Infineon's guidelines for EMC design, including using a shielded layout, minimizing loop areas, and using filters or chokes to reduce electromagnetic interference (EMI). Additionally, ensure that the device is properly decoupled and that the PCB is designed to minimize radiation.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Handle the devices by the body or the pins, avoiding touching the die or the leads.

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D1230N18T Overview

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