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D24067IM96G4Q1 - Texas Instruments

Description: Multiplexer Switch ICs Auto Cat Hi Spd CMOS 16Ch Ana Mux/Demux

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D24067IM96G4Q1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G24)
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D24067IM96G4Q1 - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G24)
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D24067IM96G4Q1 Details

  • Manufacturer Part Number:

    D24067IM96G4Q1

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    15.4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    10 Ω

  • On-state Resistance-Max (Ron):

    225 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Signal Current-Max:

    0.02 A

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    73 ns

  • Switch-on Time-Max:

    75 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

D24067IM96G4Q1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good thermal design practices, such as using a solid ground plane, placing thermal vias under the device, and keeping the thermal path short and direct to the heat sink or chassis.
  • To ensure reliable operation in high-temperature environments, it's crucial to follow the recommended operating conditions, use a suitable heat sink, and implement thermal monitoring and protection mechanisms, such as thermal shutdown or warning signals.
  • Operating the device at TJMAX can reduce its lifespan and increase the risk of thermal runaway. It's recommended to operate the device at a lower temperature to ensure reliable operation and extend its lifespan.
  • The device requires a specific power sequencing and startup procedure to ensure proper operation. It's essential to follow the recommended power-up and power-down sequences, and to ensure that the input voltage and current meet the specified requirements.
  • The device can be sensitive to electromagnetic interference (EMI) and radio-frequency interference (RFI). It's recommended to follow good EMI and RFI design practices, such as using shielding, filtering, and grounding techniques to minimize interference.

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D24067IM96G4Q1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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