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D6417709SF133BV - Renesas Electronics

Description: The SH7709S microprocessor incorporates the 32-bit SH-3 CPU. & This LSI is built in with a variety of peripheral functions such as cache memory, memory management unit (MMU), interrupt controller, timer, three serial communication interfaces, realtime clock (RTC), use break controller (UBC), bus state controller (BSC) and I/O ports. & This LSI can be used as a microcomputer for devices that require both high speed and low power consumption.

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D6417709SF133BV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - P-LFQFP208-28x28-0.50
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D6417709SF133BV - Renesas Electronics  - 3D model - Quad Flat Packages - P-LFQFP208-28x28-0.50
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D6417709SF133BV Details

  • Manufacturer Part Number:

    D6417709SF133BV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    PLQP0208KA

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    36 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Clock Frequency-Max:

    66.67 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G208

  • Length:

    28 mm

  • Number of I/O Lines:

    96

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    133 MHz

  • Supply Voltage-Max:

    2.05 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

D6417709SF133BV Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN2732EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, it involves powering up the VCC and VCCIO pins in a specific order, followed by the input clock signal.
  • The recommended PLL settings can be found in the device's user manual or application notes. These settings may include the PLL multiplication factor, input clock frequency, and output clock frequency. Renesas also provides a PLL calculation tool to help with these settings.
  • Renesas provides a JTAG interface for debugging and programming the device. Engineers can use a JTAG adapter and software tools, such as Renesas' own E1 emulator or third-party tools like Segger J-Link, to access the device's internal registers and memory.
  • Renesas provides thermal derating guidelines in the device's datasheet or application notes. These guidelines specify the maximum operating temperature and power consumption limits to ensure reliable device operation and prevent overheating.

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