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DA3X102D0L - Panasonic

Description: DA3X102D0L, Switching Diode, Switching 0.15A max, 80V 10ns Common Anode, Dual, 3-Pin, Mini3 G3 B

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PCB Footprints
DA3X102D0L - Panasonic PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Mini3-G3-B
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3D Models
DA3X102D0L - Panasonic  - 3D model - SOT23 (3-Pin) - Mini3-G3-B
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DA3X102D0L Details

  • Manufacturer Part Number:

    DA3X102D0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SC-59A, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Panasonic Electronic Components

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Capacitance-Max:

    15 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Frequency Band:

    VERY HIGH FREQUENCY

  • JEDEC-95 Code:

    TO-236AA

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

DA3X102D0L Frequently Asked Questions (FAQs)

  • Panasonic recommends a PCB layout with a solid ground plane, minimal trace length, and a 50-ohm impedance-matched transmission line to ensure optimal performance and minimize signal reflections.
  • The DA3X102D0L has a high power dissipation rating. Ensure proper thermal management by providing a heat sink or thermal pad, and maintaining a maximum junction temperature of 125°C to prevent overheating.
  • Panasonic recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.
  • The DA3X102D0L is designed to withstand moderate vibration. However, for high-vibration environments, additional mechanical support or vibration dampening measures may be necessary to ensure reliable operation.
  • Common issues include overheating, signal degradation, and power supply noise. Troubleshoot by checking the PCB layout, thermal management, power supply quality, and signal integrity. Consult the datasheet and application notes for specific guidance.

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DA3X102D0L Overview

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