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DAC3174IRGCT - Texas Instruments

Description: Dual-Channel, 14-Bit, 500-MSPS Digital-to-Analog Converter (DAC)

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PCB Footprints
DAC3174IRGCT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC0064H
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3D Models
DAC3174IRGCT - Texas Instruments  - 3D model - Quad Flat No-Lead - RGC0064H
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DAC3174IRGCT Details

  • Manufacturer Part Number:

    DAC3174IRGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    1 V

  • Analog Output Voltage-Min:

    -0.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    500 MHz

  • Seated Height-Max:

    1 mm

  • Settling Time-Nom (tstl):

    0.011 µs

  • Supply Current-Max:

    130 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

DAC3174IRGCT Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signals separate. Additionally, use a low-ESR capacitor for the VREF pin and keep the output capacitor close to the output pin.
  • The DAC3174IRGCT has an internal calibration circuit that can be enabled by setting the CAL pin high. The calibration procedure involves applying a full-scale input code and measuring the output voltage, then adjusting the offset and gain trim bits to achieve the desired output voltage.
  • The DAC3174IRGCT has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and avoid exceeding the maximum power dissipation.
  • The DAC3174IRGCT has an asynchronous update feature that allows the output to be updated without waiting for the next clock cycle. This can be handled by using a double-buffered architecture, where the new data is written to a temporary register and then transferred to the DAC output register on the next clock cycle.
  • To ensure electromagnetic compatibility, use a shielded enclosure, keep the analog and digital signals separate, use a common-mode choke on the output, and follow good PCB layout practices such as using a solid ground plane and minimizing loop areas.

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DAC3174IRGCT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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