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DAC38J82IAAV - Texas Instruments

Description: Dual-Channel, 16-Bit, 2.5-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC)

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DAC38J82IAAV - Texas Instruments - PCB symbol
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PCB Footprints
DAC38J82IAAV - Texas Instruments PCB footprint - BGA - BGA - AAV0144A
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3D Models
DAC38J82IAAV - Texas Instruments - 3D model - BGA - AAV0144A
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DAC38J82IAAV Details

  • Manufacturer Part Number:

    DAC38J82IAAV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    144

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    0.6 V

  • Analog Output Voltage-Min:

    -0.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA144,12X12,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    2500 MHz

  • Seated Height-Max:

    1.94 mm

  • Settling Time-Nom (tstl):

    0.01 µs

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

DAC38J82IAAV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep analog and digital signals separate, and use a star-configuration for power supply connections.
  • Use a low-jitter clock source (<100 ps RMS) and ensure the clock frequency is within the recommended range (1.5 GHz to 2.5 GHz). Use a clock buffer or repeater to maintain signal integrity.
  • Power up the device in the following sequence: AVDD, DVDD, and then the clock signal. Ensure all power supplies are stable before applying the clock signal.
  • Ensure the output current does not exceed the recommended maximum (150 mA). Use a suitable output impedance to prevent voltage compliance issues. Monitor the device temperature and ensure adequate heat sinking.
  • Perform a full-scale calibration after power-up, and re-calibrate after any changes to the clock frequency or output voltage. Use the device's built-in calibration registers to adjust the output voltage and current.

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DAC38J82IAAV Overview

Use the download button to access the DAC38J82IAAV schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DAC38, or try a keyword search, such as Digital to Analog Converters

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image DAC38J82IAAVR Texas Instruments

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