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DAC38RF84IAAV - Texas Instruments

Description: 14-Bit, 9-GSPS, 6x-24x Interpolating, 6 & 9 GHz PLL Digital-to-Analog Converter (DAC)

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PCB Footprints
DAC38RF84IAAV - Texas Instruments PCB footprint - BGA - BGA - AAV0144A
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DAC38RF84IAAV - Texas Instruments  - 3D model - BGA - AAV0144A
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DAC38RF84IAAV Details

  • Manufacturer Part Number:

    DAC38RF84IAAV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2017-02-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.3 V

  • Analog Output Voltage-Min:

    1.3 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -1.8 V

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA144,12X12,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    9000 MHz

  • Seated Height-Max:

    1.94 mm

  • Settling Time-Nom (tstl):

    0.001 µs

  • Supply Current-Max:

    1758 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

DAC38RF84IAAV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane, separate analog and digital power planes, and a shielded enclosure is recommended. Additionally, keep the analog and digital signal traces separate and avoid crossing them over each other.
  • The optimal clocking configuration depends on the specific application. In general, use a clock frequency that is a multiple of the DAC's sampling frequency, and ensure the clock signal is clean and jitter-free. Consult the datasheet and application notes for more information.
  • Power up the device in the following sequence: 1) AVDD, 2) DVDD, 3) AVCC, and 4) CLK. Ensure all power supplies are stable before applying the clock signal.
  • Use a logic analyzer or oscilloscope to capture the digital signals and verify they meet the timing requirements specified in the datasheet. Check for signal integrity, clock frequency, and data transmission errors.
  • The DAC38RF84IAAV has a maximum junction temperature of 125°C. Ensure good airflow, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet to prevent overheating.

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DAC38RF84IAAV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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