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DAC38RF87IAAV - Texas Instruments

Description: Dual-Channel, 14-Bit, 6.2-GSPS, 6x-24x Interpolating, 6 GHz GSM PLL Digital-to-Analog Converter

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DAC38RF87IAAV - Texas Instruments - PCB symbol
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PCB Footprints
DAC38RF87IAAV - Texas Instruments PCB footprint - BGA - BGA - AAV0144A
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3D Models
DAC38RF87IAAV - Texas Instruments - 3D model - BGA - AAV0144A
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DAC38RF87IAAV Details

  • Manufacturer Part Number:

    DAC38RF87IAAV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2017-02-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.3 V

  • Analog Output Voltage-Min:

    1.3 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -1.8 V

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA144,12X12,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    6200 MHz

  • Seated Height-Max:

    1.94 mm

  • Settling Time-Nom (tstl):

    0.001 µs

  • Supply Current-Max:

    1758 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

DAC38RF87IAAV Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DAC38RF87IAAV evaluation module (EVM) user's guide, which includes guidelines for signal routing, grounding, and decoupling. Following this layout can help minimize noise and ensure optimal performance.
  • The DAC38RF87IAAV's output impedance can be optimized by selecting the appropriate output termination resistors and capacitors. TI provides a detailed application note (SLAA725) that explains how to calculate and optimize the output impedance for specific applications.
  • While the datasheet specifies a maximum clock frequency of 2.5 GHz, the actual maximum frequency may be limited by the specific application and PCB layout. TI recommends consulting with their support team or performing simulations to determine the maximum clock frequency for a specific design.
  • To ensure data integrity, it is essential to implement error detection and correction mechanisms, such as CRC or ECC, in the digital data transmission path. Additionally, using a robust clocking scheme and ensuring proper signal integrity can help prevent errors during data transmission.
  • TI recommends following a specific power-up and power-down sequence to ensure proper operation and prevent damage to the device. This sequence is outlined in the datasheet and includes powering up the digital supply before the analog supply, and powering down the analog supply before the digital supply.

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DAC38RF87IAAV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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