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DAC38RF96IAAV - Texas Instruments

Description: Dual-Channel, 14-Bit, 9-GSPS, 12x-24x Interpolating, 9 GHz GSM PLL Digital-to-Analog Converter (DAC)

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PCB Footprints
DAC38RF96IAAV - Texas Instruments PCB footprint - BGA - BGA - AAV0144A
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3D Models
DAC38RF96IAAV - Texas Instruments  - 3D model - BGA - AAV0144A
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DAC38RF96IAAV Details

  • Manufacturer Part Number:

    DAC38RF96IAAV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2017-02-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.3 V

  • Analog Output Voltage-Min:

    1.3 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -1.8 V

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA144,12X12,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    9000 MHz

  • Seated Height-Max:

    1.94 mm

  • Settling Time-Nom (tstl):

    0.001 µs

  • Supply Current-Max:

    1758 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

DAC38RF96IAAV Frequently Asked Questions (FAQs)

  • The recommended clocking scheme is to use a single clock source for both the DAC and JESD204B interfaces. This ensures proper synchronization and minimizes clock domain crossing issues.
  • To minimize power consumption, use the device's built-in power-down modes, adjust the clock frequency, and optimize the digital signal processing (DSP) settings. Additionally, consider using the device's internal voltage regulators to reduce external power supply requirements.
  • The DAC38RF96IAAV supports JESD204B data transfer rates up to 12.5 Gbps per lane, with a maximum of 4 lanes. This translates to a total data transfer rate of up to 50 Gbps.
  • To ensure proper synchronization, use the DAC38RF96IAAV's SYSREF input to synchronize the device with the FPGA/ASIC. Additionally, use the device's built-in synchronization features, such as the SYNC_IN and SYNC_OUT pins, to align the data transfer with the system clock.
  • To ensure optimal performance, follow Texas Instruments' recommended PCB layout guidelines, including using a 4-layer PCB, separating analog and digital signals, and using proper decoupling and shielding techniques. Additionally, consider using a thermal pad and heat sink to manage the device's thermal dissipation.

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DAC38RF96IAAV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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