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DAC7562TDGST - Texas Instruments

Description: DAC7562T Dual,12-Bit,Low Power,Voltage-Output DACs with 2.5-V,4ppm/C, Internal Ref, and 5V TTL I/O

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DAC7562TDGST - Texas Instruments - PCB symbol
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PCB Footprints
DAC7562TDGST - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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3D Models
DAC7562TDGST - Texas Instruments - 3D model - Small Outline Packages - DGS0010A
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DAC7562TDGST Details

  • Manufacturer Part Number:

    DAC7562TDGST

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.1 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    7 µs

  • Supply Voltage-Nom:

    5.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC7562TDGST Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital interface (SCL and SDA) to prevent any unwanted voltage conditions on the device.
  • To ensure accurate voltage output, it is essential to use a stable and low-noise voltage reference (VREF), and to decouple the VREF pin with a capacitor to filter out any noise. Additionally, the output voltage should be buffered with an op-amp if it needs to drive a load.
  • The DAC7562 output can drive a maximum capacitance of 1000 pF. Exceeding this limit may cause instability or oscillations in the output voltage.
  • To implement a voltage output range other than 0-5V, you can use an external amplifier or resistive divider network to scale the output voltage. Additionally, you can also use an external reference voltage (VREF) other than 5V to achieve the desired output range.
  • The maximum data transfer rate for the I2C interface of the DAC7562 is 400 kHz. However, it is recommended to use a lower clock frequency to ensure reliable data transfer and to avoid any potential issues with noise or signal integrity.

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DAC7562TDGST Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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