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DAC7571IDBVRG4 - Texas Instruments

Description: Digital to Analog Converters - DAC Lo-Pwr R-To-R Output 12-Bit I2C Input

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PCB Footprints
DAC7571IDBVRG4 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
DAC7571IDBVRG4 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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DAC7571IDBVRG4 Details

  • Manufacturer Part Number:

    DAC7571IDBVRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    GREEN, PLASTIC, SOT-23, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Linearity Error-Max (EL):

    0.195%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    8 µs

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

DAC7571IDBVRG4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital interface signals (SCLK, SDIN, and SYNC). This ensures proper device operation and prevents potential latch-up conditions.
  • The output voltage settling time can be minimized by using a capacitor (typically 10nF to 100nF) between the output pin and GND. This capacitor helps to filter out high-frequency noise and reduces the settling time. Additionally, the DAC7571 has a built-in output buffer that helps to reduce the settling time.
  • The maximum output current that the DAC7571 can drive is 5mA. Exceeding this current limit may cause the output voltage to droop or the device to overheat. If a higher output current is required, an external buffer amplifier can be used.
  • To ensure accurate output voltage levels when using an external reference voltage, it is essential to ensure that the reference voltage is stable and noise-free. A low-noise, low-drift reference voltage source, such as a voltage reference IC, should be used. Additionally, the reference voltage should be decoupled from the power supply using a capacitor (typically 10uF to 100uF) to reduce noise and ripple.
  • To minimize noise and interference, the DAC7571 should be placed away from high-frequency noise sources, such as switching regulators and digital logic. The analog and digital grounds should be separated, and the analog ground should be connected to the digital ground at a single point. Additionally, the output pin should be routed away from the digital signals, and a ground plane should be used to shield the output signal.

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DAC7571IDBVRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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