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DAC8163SDGSR - Texas Instruments

Description: 14-Bit, Dual, Low Power, Ultra-low Glitch, Buffered Voltage Output DAC with 2.5V, 4ppm/°C Reference

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PCB Footprints
DAC8163SDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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DAC8163SDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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DAC8163SDGSR Details

  • Manufacturer Part Number:

    DAC8163SDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0183%

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.1 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    7 µs

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC8163SDGSR Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital supply (VCC). This ensures proper device operation and prevents potential latch-up conditions.
  • The DAC8163SDGSR has a rail-to-rail output stage, but it's essential to ensure the output voltage range is within the specified limits (0 to VREF) to avoid output stage saturation and maintain linearity.
  • Clock jitter can affect the DAC's performance, particularly in high-frequency applications. It's recommended to use a low-jitter clock source and ensure the clock signal meets the specified jitter requirements to maintain optimal performance.
  • A proper layout and grounding scheme is crucial for the DAC's performance. Ensure a solid ground plane, separate analog and digital grounds, and keep sensitive analog signals away from digital signals. Follow the recommended layout guidelines in the datasheet and application notes.
  • The DAC8163SDGSR has a built-in calibration feature. Use the CAL pin to initiate calibration, and follow the recommended calibration procedure outlined in the datasheet and application notes to ensure optimal performance.

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DAC8163SDGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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