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DAC8551IADGKRG4 - Texas Instruments

Description: Digital to Analog Converters - DAC 16B Ultralow Glitch Vltg Output DAC

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DAC8551IADGKRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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DAC8551IADGKRG4 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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DAC8551IADGKRG4 Details

  • Manufacturer Part Number:

    DAC8551IADGKRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    VSSOP-8

  • Pin Count:

    8

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0183%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    12 µs

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC8551IADGKRG4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital interface (SCL and SDA). This ensures proper device operation and prevents potential latch-up conditions.
  • The DAC8551 has an output voltage range of 0 to VREF. To ensure accurate output voltage, the reference voltage (VREF) should be set to a value that is within the specified range (2.5V to 5.5V). Additionally, the output voltage should be buffered with an op-amp if it needs to drive a load.
  • The maximum clock frequency for the I2C interface of the DAC8551 is 400 kHz. Exceeding this frequency may result in communication errors or device malfunction.
  • The DAC8551 has a power-down mode that can be enabled by writing a specific code to the control register. In power-down mode, the device consumes minimal power and the output voltage is high-impedance. Refer to the datasheet for the specific code and implementation details.
  • The thermal shutdown temperature of the DAC8551 is typically 150°C. If the device temperature exceeds this value, it will shut down to prevent damage. The device will automatically restart when the temperature drops below 140°C.

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DAC8551IADGKRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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