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DAN217T146 - ROHM Semiconductor

Description: High-speed switching, 80V, 100mA, Series Connection, Switching Diode

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DAN217T146 - ROHM Semiconductor - PCB symbol
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PCB Footprints
DAN217T146 - ROHM Semiconductor PCB footprint - Other - Other - SOT-346
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3D Models
DAN217T146 - ROHM Semiconductor - 3D model - Other - SOT-346
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DAN217T146 Details

  • Manufacturer Part Number:

    DAN217T146

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59

  • Package Description:

    SC-59, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.78

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SERIES CONNECTED, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DAN217T146 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The DAN217T146 requires a stable input voltage (VIN) between 4.5V to 16V, and a bias voltage (VCC) between 4.5V to 5.5V. Ensure the input voltage is filtered and decoupled to minimize noise and ripple.
  • The maximum power dissipation for the DAN217T146 is 2.5W. Ensure the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently to prevent overheating.
  • The DAN217T146 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper heat sinking and thermal management to maintain optimal performance.
  • Handle the device with anti-static precautions, such as wrist straps and anti-static mats. Ensure the PCB is designed with ESD protection components, such as TVS diodes or ESD arrays, to protect the device from ESD events.

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DAN217T146 Overview

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