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DAN217UT106 - ROHM Semiconductor

Description: Switching Diode

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PCB Footprints
DAN217UT106 - ROHM Semiconductor PCB footprint - Other - Other - UMD3 (SC-70)
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3D Models
DAN217UT106 - ROHM Semiconductor  - 3D model - Other - UMD3 (SC-70)
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DAN217UT106 Details

  • Manufacturer Part Number:

    DAN217UT106

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SERIES CONNECTED, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DAN217UT106 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to ROHM's application note for detailed guidelines.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the specified ranges. Implement overvoltage protection, undervoltage lockout, and thermal monitoring to prevent damage.
  • Use a shielded layout, decouple the input and output with capacitors, and add a common-mode choke to reduce EMI. Ensure the PCB layout and component selection meet the relevant EMC standards.
  • Yes, the DAN217UT106 is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions, and consult ROHM's reliability report for detailed information.
  • Consult ROHM's troubleshooting guide and application notes for common issues and solutions. Verify the PCB layout, component selection, and operating conditions meet the recommended specifications.

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DAN217UT106 Overview

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