ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure SOA, monitor the device's junction temperature, voltage, and current. Use a thermal management system, and consider derating the device's power rating based on the application's operating conditions.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more information.
Yes, the DAP202FMFHT106 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that your design meets the required qualification standards and guidelines.
Handle the device with ESD-protective equipment, such as wrist straps and mats. Ensure that the device is stored in an ESD-protective package, and follow proper assembly procedures to minimize ESD exposure.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
DAP202FMFHT106 Overview
Use the download button to access the DAP202FMFHT106 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DAP20,
or try a keyword search, such as Rectifier Diodes
