ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, depending on the specific application requirements. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
To prevent EOS and ESD damage, follow proper handling and assembly procedures, including using anti-static wrist straps, mats, and packaging materials. Ensure that the device is properly soldered and connected to a PCB with adequate clearance and creepage distances.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 47uF, depending on the specific application requirements. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ensure stable operation.
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DAP222ZMT2L Overview
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