Part Image

DB155G - GeneSiC Semiconductor

Description: Bridge Rectifier Single Phase Standard 600 V Through Hole DB

Download DB155G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
DB155G - GeneSiC Semiconductor PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DB
click to zoom
3D Models
DB155G - GeneSiC Semiconductor  - 3D model - Dual-In-Line Packages - DB
click to zoom

DB155G Details

  • Manufacturer Part Number:

    DB155G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    GeneSic Semiconductor Inc

  • YTEOL:

    6.62

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDIP-T4

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    250

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

DB155G Frequently Asked Questions (FAQs)

  • GeneSic recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer for heat dissipation. A minimum of 2 oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive material for the heat sink, and maintain a maximum junction temperature (Tj) of 150°C. Also, consider derating the device's current rating at high temperatures.
  • GeneSic recommends a gate drive voltage of 15V to 20V and a current of 1A to 2A for optimal switching performance. However, the specific requirements may vary depending on the application and PCB layout.
  • Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) circuit to prevent damage from voltage and current surges. GeneSic recommends using a TVS diode and a fuse or a current sense resistor for OCP.
  • The DB155G is suitable for operating frequencies up to 100 kHz. However, the specific frequency range may vary depending on the application and PCB layout. GeneSic recommends consulting the datasheet and application notes for more information.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

DB155G Overview

Use the download button to access the DB155G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DB155, or try a keyword search, such as Bridge Rectifier Diodes

Parts related to DB155G

Showing 0 results