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DB3J316F0L - Panasonic

Description: DB3J316F0L, Schottky Diode, Small Signal Diode, Switching 0.1A max, 30V 0.8ns Cathode-Anode, Dual, 3-Pin, SMini3 F2 B

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Symbol
DB3J316F0L - Panasonic - PCB symbol
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PCB Footprints
DB3J316F0L - Panasonic PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SMini3-F2-B
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3D Models
DB3J316F0L - Panasonic - 3D model - SO Transistor Flat Lead - SMini3-F2-B
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DB3J316F0L Details

  • Manufacturer Part Number:

    DB3J316F0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SC-85, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Panasonic Electronic Components

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • Frequency Band:

    VERY HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-F3

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DB3J316F0L Frequently Asked Questions (FAQs)

  • The recommended land pattern for the DB3J316F0L is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm.
  • The DB3J316F0L has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or thermal tape, and keep the component away from heat sources.
  • The recommended soldering temperature profile for the DB3J316F0L is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
  • Yes, the DB3J316F0L is designed to withstand vibrations up to 10G. However, it's recommended to perform additional testing and validation for specific vibration requirements.
  • To ensure reliability in humid environments, apply a conformal coating to the PCB, and follow proper storage and handling procedures to prevent moisture absorption.

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DB3J316F0L Overview

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