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DB3X313F0L - Panasonic

Description: DB3X313F0L, Schottky Diode, Small Signal Diode 0.2A max, 30V 1.5ns Cathode-Anode, Dual, 3-Pin, Mini3 G3 B

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Symbol
DB3X313F0L - Panasonic - PCB symbol
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PCB Footprints
DB3X313F0L - Panasonic PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Mini3-G3-B
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3D Models
DB3X313F0L - Panasonic - 3D model - SOT23 (3-Pin) - Mini3-G3-B
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DB3X313F0L Details

  • Manufacturer Part Number:

    DB3X313F0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SC-59A, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Panasonic Electronic Components

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • Frequency Band:

    ULTRA HIGH FREQUENCY

  • JEDEC-95 Code:

    TO-236AA

  • JESD-30 Code:

    R-PDSO-G3

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DB3X313F0L Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. Keep the input and output traces separate and avoid crossing them.
  • Use a thermal management strategy such as a heat sink or thermal pad to maintain a junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Exceeding maximum ratings can lead to reduced lifespan, decreased performance, or even permanent damage. Ensure that the device operates within the specified voltage, current, and temperature ranges.
  • Use a systematic approach to identify the issue. Check the power supply, input/output connections, and PCB layout. Use oscilloscopes or logic analyzers to debug signal integrity issues.
  • Yes, ensure proper shielding, grounding, and decoupling to minimize EMI. Use a common-mode choke or ferrite bead to reduce emissions. Follow PCB design guidelines for EMI reduction.

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DB3X313F0L Overview

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