Sanrex recommends a 4-layer PCB with a dedicated ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the power traces. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal interface material.
Sanrex recommends derating the output power by 1.5% per degree Celsius above 50°C to ensure reliable operation. Additionally, the device should be mounted on a heat sink with a thermal resistance of less than 10°C/W to maintain a junction temperature below 125°C.
Sanrex recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for at least 50V, placed as close as possible to the input pins of the device.
Sanrex recommends using a TVS diode or a zener diode with a voltage rating of at least 1.5 times the maximum input voltage to protect against overvoltage. Additionally, a fuse or a current-limiting resistor should be used to protect against overcurrent conditions.
Sanrex recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp rate of 3°C/second to prevent thermal damage to the device.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
DBA200YA40 Overview
Use the download button to access the DBA200YA40 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DBA20,
or try a keyword search, such as Rectifier Diodes
