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DF02S2 - onsemi

Description: Obsolete - 1.5A Bridge Rectifier

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Symbol
DF02S2 - onsemi - PCB symbol
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PCB Footprints
DF02S2 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - sdip4
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3D Models
DF02S2 - onsemi - 3D model - Small Outline Packages - sdip4
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DF02S2 Details

  • Manufacturer Part Number:

    DF02S2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP-4 GW

  • Package Description:

    SDIP-4

  • Manufacturer Package Code:

    709AE

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    85 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DF02S2 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND8325/D for more details.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Use a human body model (HBM) ESD protection circuit with a minimum of 2kV rating. Implement ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to prevent damage from electrostatic discharge.
  • Ensure that the power supplies are sequenced correctly to prevent damage to the device. The recommended power-up sequence is: VCC, then VIN, and finally EN. The power-down sequence should be reversed.
  • Use a minimum of 1uF ceramic capacitors for decoupling, placed as close as possible to the device's power pins. Additional capacitors can be added in parallel to reduce noise and improve stability.

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DF02S2 Overview

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