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DF2134FA20V - Renesas Electronics

Description: The H8S/2138, 2134 Group is supported only for customers who have already adopted these products. The RX230 Group is recommended for new designs.

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DF2134FA20V - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-80A
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DF2134FA20V - Renesas Electronics  - 3D model - Quad Flat Packages - FP-80A
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DF2134FA20V Details

  • Manufacturer Part Number:

    DF2134FA20V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    QFP-80

  • Pin Count:

    80

  • Manufacturer Package Code:

    PRQP0080JB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2018-06-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e6

  • Length:

    14 mm

  • Number of Terminals:

    80

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • RAM (bytes):

    4096

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    3.05 mm

  • Speed:

    20 MHz

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF2134FA20V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • The power-on sequence should follow this order: VCC, AVCC, and then VREF. Ensure a minimum delay of 10 ms between each power-up step.
  • Implement ESD protection diodes (e.g., 1.5KE6.8A) on all input/output pins. Ensure a minimum of 1 kΩ series resistance on each pin.
  • Use a 10 μF ceramic capacitor (X7R or X5R dielectric) with a 0.1 μF ceramic capacitor in parallel, placed as close to the device as possible.

Trust Checks

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Manufacturer Collaborated
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Community Approved
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DF2134FA20V Overview

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