Description:The H8S/2140B Group is supported only for customers who have already adopted these products. The RX651, RX210 Groups are recommended for new designs.
Renesas provides a recommended PCB layout in the application note 'DF2161BVT10V Thermal Design Guide' (document number: R20AN0243EJ0100). It suggests using a 4-layer PCB with a thermal pad connected to the ground plane, and placing thermal vias under the package to improve heat dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and thermal design guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Renesas also recommends using a thermistor or thermal sensor to monitor the temperature and implement thermal protection mechanisms if necessary.
The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 4.7 μF to 10 μF, and the output capacitor (COUT) should be a low-ESR ceramic capacitor with a value between 10 μF to 22 μF. The capacitors should be placed close to the IC and have a low inductance path to the power pins.
To optimize the layout for low EMI and noise, follow the recommended PCB layout guidelines, keep the power traces short and wide, and use a solid ground plane. Additionally, place the input and output capacitors close to the IC, and use a shield or a metal can to enclose the switching regulator. Renesas also recommends using a common-mode choke or a ferrite bead to filter the output voltage.
The bootstrap capacitor (CBST) should be a ceramic capacitor with a value between 10 nF to 100 nF, and the bootstrap resistor (RBST) should be a 1 kΩ to 10 kΩ resistor. The bootstrap capacitor should be placed close to the IC, and the bootstrap resistor should be connected between the bootstrap pin and the input voltage.
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