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DF2167VT33V - Renesas Electronics

Description: The H8S/2168 Group is supported only for customers who have already adopted these products. The RX651, RX210 Groups are recommended for new designs.

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DF2167VT33V - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - TFP-144
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DF2167VT33V - Renesas Electronics  - 3D model - Quad Flat Packages - TFP-144
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DF2167VT33V Details

  • Manufacturer Part Number:

    DF2167VT33V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TFQFP

  • Pin Count:

    144

  • Manufacturer Package Code:

    PTQP0144LC

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    H8S/2000

  • Clock Frequency-Max:

    33 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    16 mm

  • Number of I/O Lines:

    114

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP144,.7SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    40960

  • ROM (words):

    393216

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    33 MHz

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF2167VT33V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Critical timing parameters include the clock frequency, clock duty cycle, and setup/hold times for the input signals. Refer to the datasheet for specific values.
  • Use a logic analyzer or oscilloscope to monitor signal integrity and timing. Check for power supply noise, signal attenuation, and incorrect pin connections.
  • Use 0.1 μF to 1 μF ceramic capacitors with a voltage rating of 10 V or higher, placed as close to the IC as possible.

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