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DF2556FC20DV - Renesas Electronics

Description: The H8S/2556, 2552, 2506 Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs.

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PCB Footprints
DF2556FC20DV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PRQP0144KA-A
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3D Models
DF2556FC20DV - Renesas Electronics  - 3D model - Quad Flat Packages - PRQP0144KA-A
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DF2556FC20DV Details

  • Manufacturer Part Number:

    DF2556FC20DV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FQFP

  • Package Description:

    20 X 20 MM, 3.05 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, FQFP-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    PRQP0144KB

  • Country Of Origin:

    Japan

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    26 Weeks, 1 Day

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    16

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Number of I/O Lines:

    102

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    3.05 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF2556FC20DV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices. Implement EMI filters, and consider using a common-mode choke or ferrite beads on the power lines. Also, ensure that the device is properly decoupled.
  • Use the device's power-saving modes, optimize the clock frequency, and minimize the number of active peripherals. Also, consider using a low-dropout regulator (LDO) or a switching regulator with a high efficiency.
  • Use a version control system, implement a modular firmware architecture, and use a debug tool like a JTAG or SWD interface. Also, consider using a real-time operating system (RTOS) and a firmware framework.

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DF2556FC20DV Overview

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