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DF2B29FU,H3F - Toshiba

Description: ESD Suppressors / TVS Diodes ESD Protection Diode SNG Bi-directional

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DF2B29FU,H3F - Toshiba PCB footprint - Other - Other - USC (1-1E1A)
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DF2B29FU,H3F - Toshiba  - 3D model - Other - USC (1-1E1A)
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DF2B29FU,H3F Details

  • Manufacturer Part Number:

    DF2B29FU,H3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.38

  • Breakdown Voltage-Max:

    32 V

  • Breakdown Voltage-Min:

    26 V

  • Breakdown Voltage-Nom:

    29 V

  • Clamping Voltage-Max:

    47 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Peak Rev Power Dis-Max:

    140 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-5; ISO 10605

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

DF2B29FU,H3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested.
  • Implement a heat sink or thermal management system to keep the junction temperature below 150°C. Ensure good airflow and avoid thermal hotspots.
  • Handle the device with an ESD wrist strap or mat, and store it in an anti-static bag or container to prevent damage from electrostatic discharge.
  • Yes, but consult with Toshiba's reliability report and follow their guidelines for high-reliability applications. Additional testing and qualification may be required.
  • Use a logic analyzer or oscilloscope to monitor signals and identify issues. Consult the datasheet and application notes for troubleshooting guidelines.

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