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DF2B36FU,H3F - Toshiba

Description: ESD Suppressors / TVS Diodes ESD protection diode Bi-directional type

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DF2B36FU,H3F - Toshiba PCB footprint - Other - Other - USC (1-1E1A)
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DF2B36FU,H3F - Toshiba  - 3D model - Other - USC (1-1E1A)
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DF2B36FU,H3F Details

  • Manufacturer Part Number:

    DF2B36FU,H3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Breakdown Voltage-Max:

    40 V

  • Breakdown Voltage-Min:

    32 V

  • Breakdown Voltage-Nom:

    36 V

  • Clamping Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Peak Rev Power Dis-Max:

    150 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5; ISO 10605

  • Rep Pk Reverse Voltage-Max:

    28 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    28 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

DF2B36FU,H3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (-40°C to 150°C).
  • Handle the device by the body, avoid touching the leads, and store in a dry, cool place away from direct sunlight. Use anti-static packaging and follow ESD precautions.
  • Yes, but ensure compliance with relevant industry standards (e.g., AEC-Q101 for automotive) and perform thorough testing and validation.
  • Consult the datasheet, application notes, and Toshiba's technical support resources. Perform thorough debugging, and consider consulting with a Toshiba FAE or a qualified engineer.

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