DF2B5PCT,L3F footprint, schematic symbol and 3D model by Toshiba

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DF2B5PCT,L3F - Toshiba PCB footprint - Other - Other - DF2B5PCT,L3F-2

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Part Number DF2B5PCT,L3F
Manufacturer Toshiba
Pin Count 2
Part Category TVS Diode (Bi-directional)
Package Category Other
Footprint Name Other - DF2B5PCT,L3F-2
Released Date Feb 14, 2024
Last Modified Date Apr 4, 2025 2:48 PM UTC
Pinout / Pin List Click Here (Member Only)

DF2B5PCT,L3F Details

Manufacturer Part Number:
DF2B5PCT,L3F
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
12 Weeks
Manufacturer:
Toshiba America Electronic Components
YTEOL:
7
Breakdown Voltage-Max:
6.5 V
Breakdown Voltage-Min:
3.7 V
Breakdown Voltage-Nom:
4.8 V
Clamping Voltage-Max:
22 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-XBCC-N2
Non-rep Peak Rev Power Dis-Max:
590 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity:
BIDIRECTIONAL
Reference Standard:
IEC-61000-4-2, 4-5
Rep Pk Reverse Voltage-Max:
3.6 V
Reverse Current-Max:
0.1 µA
Reverse Test Voltage:
3.6 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

DF2B5PCT,L3F Frequently Asked Questions (FAQs)

Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
Toshiba suggests using a heat sink, ensuring good airflow, and following the recommended derating curves for temperature and current to ensure reliable operation in high-temperature environments.
The maximum allowable power dissipation for the DF2B5PCT,L3F is 2.5W, and it's essential to follow the recommended derating curves to ensure safe operation.
Yes, the DF2B5PCT,L3F is suitable for switching regulator applications due to its low RDS(on) and high current capability, but ensure to follow the recommended operating conditions and layout guidelines.
Toshiba recommends using ESD protection devices, such as TVS diodes or ESD arrays, and following proper handling and storage procedures to prevent ESD damage.

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