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DF2B6.8E,L3F - Toshiba

Description: ESD Suppressors / TVS Diodes ESD Bi-Directional Protection Diode

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Symbol
DF2B6.8E,L3F - Toshiba - PCB symbol
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PCB Footprints
DF2B6.8E,L3F - Toshiba PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - 1-1G1A
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3D Models
DF2B6.8E,L3F - Toshiba - 3D model - Small Outline Diode Flat Lead - 1-1G1A
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DF2B6.8E,L3F Details

  • Manufacturer Part Number:

    DF2B6.8E,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    7.8 V

  • Breakdown Voltage-Min:

    5.8 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.15 W

  • Reference Standard:

    IEC 61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2B6.8E,L3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (-40°C to 150°C). Also, consider derating the device for high-temperature applications.
  • Handle the device with anti-static wrist straps, mats, or bags. Avoid touching the pins or leads, and use ESD-protected workstations and tools.
  • Yes, but ensure compliance with relevant industry standards (e.g., MIL-STD-883) and perform thorough testing and validation for your specific application.
  • Consult the datasheet and application notes, then contact Toshiba's technical support or a local representative for guidance on troubleshooting and potential replacement or repair.

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DF2B6.8E,L3F Overview

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