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DF2S14P2FU,H3F - Toshiba

Description: ESD protection diode (standard type, single) IPP:50A, RDYN = 0.08 Ω VESD = ±30 kV

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DF2S14P2FU,H3F - Toshiba PCB footprint - Other - Other - DF2S14P2FU,H3F-2
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DF2S14P2FU,H3F - Toshiba  - 3D model - Other - DF2S14P2FU,H3F-2
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DF2S14P2FU,H3F Details

  • Manufacturer Part Number:

    DF2S14P2FU,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    8

  • Breakdown Voltage-Max:

    15.5 V

  • Breakdown Voltage-Min:

    12.9 V

  • Breakdown Voltage-Nom:

    13.5 V

  • Clamping Voltage-Max:

    32 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Peak Rev Power Dis-Max:

    1600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2,4-5

  • Rep Pk Reverse Voltage-Max:

    12.6 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    12.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S14P2FU,H3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Toshiba recommends following the recommended operating temperature range, using a heat sink if necessary, and ensuring good airflow around the device.
  • The maximum allowable power dissipation for the DF2S14P2FU,H3F is 2.5W, and it's essential to ensure that the device operates within this limit to prevent overheating.
  • While the device is not specifically designed for high-humidity environments, Toshiba recommends following proper moisture protection and handling procedures to minimize the risk of damage.
  • Toshiba recommends storing the device in a dry, cool place, away from direct sunlight, and in its original packaging or anti-static bag to prevent damage.

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DF2S14P2FU,H3F Overview

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