DF2S23P2CTC,L3F footprint, schematic symbol and 3D model by Toshiba

Symbol

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PCB Footprints

DF2S23P2CTC,L3F - Toshiba PCB footprint - Other - Other - DF2S23P2CTC,L3F-1

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3D Models

DF2S23P2CTC,L3F - Toshiba - 3D model - Other - DF2S23P2CTC,L3F-1

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Datasheet Download Datasheet
Stock & Prices Price & Stock for DF2S23P2CTC,L3F
Part Number DF2S23P2CTC,L3F
Manufacturer Toshiba
Pin Count 2
Part Category Diode ESD (Uni-directional)
Package Category Other
Footprint Name Other - DF2S23P2CTC,L3F-1
Released Date Mar 31, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

DF2S23P2CTC,L3F Details

Manufacturer Part Number:
DF2S23P2CTC,L3F
Rohs Code:
Yes
Part Life Cycle Code:
Not Recommended
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
12 Weeks
Manufacturer:
Toshiba America Electronic Components
YTEOL:
3
Breakdown Voltage-Max:
25.5 V
Breakdown Voltage-Min:
21.5 V
Breakdown Voltage-Nom:
24.1 V
Clamping Voltage-Max:
35.7 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-XBCC-N2
Non-rep Peak Rev Power Dis-Max:
500 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity:
UNIDIRECTIONAL
Reference Standard:
IEC-61000-4-2,4-5
Rep Pk Reverse Voltage-Max:
21 V
Reverse Current-Max:
0.1 µA
Reverse Test Voltage:
21 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

DF2S23P2CTC,L3F Frequently Asked Questions (FAQs)

Toshiba provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure optimal thermal performance and prevent thermal issues.
The datasheet provides general guidelines, but it's recommended to consult Toshiba's application notes and technical support for specific guidance on power sequencing and startup procedures to ensure reliable operation.
Toshiba provides recommended soldering conditions and reflow profiles in their application notes. It's crucial to follow these guidelines to prevent damage during the soldering process.
Toshiba provides guidelines on EMC and EMI reduction in their application notes. Additionally, it's recommended to consult with a qualified EMC engineer to ensure compliance with relevant standards and regulations.
Toshiba provides reliability and quality metrics in their datasheet and application notes. The device meets industry standards such as AEC-Q100 and ISO/TS 16949 for automotive applications.

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DF2S23P2CTC,L3F Overview

Use the download button to access the DF2S23P2CTC,L3F schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like DF2S2, or try a keyword search, such as Transient Suppressors

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DF2S23P2CTC,L3F - Toshiba

DF2S23P2CTC,L3F Details

DF2S23P2CTC,L3F Frequently Asked Questions (FAQs)

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