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DF2S23P2FU,H3F - Toshiba

Description: ESD Suppressors / TVS Diodes Uni-Directional ESD protection diode VRWM:21V IPP: 14A Vesd:+/-30kV

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DF2S23P2FU,H3F - Toshiba - PCB symbol
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PCB Footprints
DF2S23P2FU,H3F - Toshiba PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323-1
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3D Models
DF2S23P2FU,H3F - Toshiba - 3D model - Small Outline Diode - SOD-323-1
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DF2S23P2FU,H3F Details

  • Manufacturer Part Number:

    DF2S23P2FU,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Breakdown Voltage-Max:

    25.5 V

  • Breakdown Voltage-Min:

    21.5 V

  • Breakdown Voltage-Nom:

    24.1 V

  • Clamping Voltage-Max:

    35.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Peak Rev Power Dis-Max:

    500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2,4-5

  • Rep Pk Reverse Voltage-Max:

    21 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    21 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S23P2FU,H3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
  • The DF2S23P2FU,H3F has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions, such as using an anti-static wrist strap, anti-static bags, and an ESD-safe work environment.
  • Yes, the DF2S23P2FU,H3F is suitable for high-reliability and automotive applications. However, it is recommended to consult with Toshiba's application engineers to ensure the device meets the specific requirements of your application.
  • Toshiba recommends following the soldering conditions specified in the datasheet, including a peak temperature of 260°C and a soldering time of 10 seconds or less.

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DF2S23P2FU,H3F Overview

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