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DF2S5M4CT,L3F - Toshiba

Description: ESD Suppressors / TVS Diodes ESD protection diode .5pF 3.7V

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Symbol
DF2S5M4CT,L3F - Toshiba - PCB symbol
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PCB Footprints
DF2S5M4CT,L3F - Toshiba PCB footprint - Other - Other - DF2S5M4CT,L3F-3
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3D Models
DF2S5M4CT,L3F - Toshiba - 3D model - Other - DF2S5M4CT,L3F-3
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DF2S5M4CT,L3F Details

  • Manufacturer Part Number:

    DF2S5M4CT,L3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    5.5 V

  • Breakdown Voltage-Min:

    3.7 V

  • Breakdown Voltage-Nom:

    4.3 V

  • Clamping Voltage-Max:

    18 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N2

  • Non-rep Peak Rev Power Dis-Max:

    30 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    3.6 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S5M4CT,L3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions.
  • While the DF2S5M4CT,L3F is a high-quality device, it is not specifically designed for high-reliability or aerospace applications. For such applications, consider using devices with specific certifications (e.g., QML or ESCC).
  • Toshiba recommends soldering at a temperature of 260°C (500°F) for 10 seconds or less, using a solder with a melting point above 217°C (423°F).

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DF2S5M4CT,L3F Overview

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