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DF2S6.2ASL,L3F - Toshiba

Description: ESD Suppressors / TVS Diodes ESD Protection Diode

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DF2S6.2ASL,L3F - Toshiba PCB footprint - Other - Other - DF2S6.2ASL,L3F-1
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3D Models
DF2S6.2ASL,L3F - Toshiba  - 3D model - Other - DF2S6.2ASL,L3F-1
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DF2S6.2ASL,L3F Details

  • Manufacturer Part Number:

    DF2S6.2ASL,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    6.6 V

  • Breakdown Voltage-Min:

    5.8 V

  • Breakdown Voltage-Nom:

    6.2 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N2

  • Non-rep Peak Rev Power Dis-Max:

    37 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S6.2ASL,L3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (-40°C to 150°C).
  • The maximum allowed voltage on the input pins is 5.5V to prevent damage to the internal ESD protection diodes.
  • Yes, but ensure the device is properly bypassed and decoupled to minimize noise and ringing. Follow proper PCB layout and routing guidelines.
  • Follow standard ESD handling procedures, use an ESD wrist strap or mat, and ensure all equipment is properly grounded.

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DF2S6.2ASL,L3F Overview

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