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DF2S6.8FS,L3M - Toshiba

Description: ESD Suppressors / TVS Diodes ESD Protection Diode

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Symbol
DF2S6.8FS,L3M - Toshiba - PCB symbol
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PCB Footprints
DF2S6.8FS,L3M - Toshiba PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - 1-1AH1A (SOD-923)
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3D Models
DF2S6.8FS,L3M - Toshiba - 3D model - Small Outline Diode Flat Lead - 1-1AH1A (SOD-923)
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DF2S6.8FS,L3M Details

  • Manufacturer Part Number:

    DF2S6.8FS,L3M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-923, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    7.2 V

  • Breakdown Voltage-Min:

    6.4 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    9 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S6.8FS,L3M Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal relief pattern and a solid ground plane to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended for the PCB.
  • Toshiba recommends using a soldering iron with a temperature of 350°C (662°F) and a solder with a melting point of 217°C (423°F) or higher. The device should be soldered within 3 seconds to prevent thermal damage.
  • The maximum allowed voltage for the DF2S6.8FS,L3M is 1.1 times the rated voltage (6.8V). Exceeding this voltage may cause permanent damage to the device.
  • Toshiba recommends storing the device in a dry, cool place away from direct sunlight. The device should be handled with anti-static precautions to prevent ESD damage.
  • The recommended operating temperature range for the DF2S6.8FS,L3M is -40°C to 125°C (-40°F to 257°F). Operating outside this range may affect the device's performance and reliability.

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DF2S6.8FS,L3M Overview

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