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DF2S6M4SL,L3F - Toshiba

Description: 15V Clamp 2A Ipp Tvs Diode Surface Mount SL2 , 30W , 0.35pF @ 1MHz , 150°C (TJ)

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DF2S6M4SL,L3F - Toshiba - PCB symbol
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PCB Footprints
DF2S6M4SL,L3F - Toshiba PCB footprint - Other - Other - SL2_2025
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3D Models
DF2S6M4SL,L3F - Toshiba - 3D model - Other - SL2_2025
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DF2S6M4SL,L3F Details

  • Manufacturer Part Number:

    DF2S6M4SL,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    7.9 V

  • Breakdown Voltage-Min:

    5.6 V

  • Breakdown Voltage-Nom:

    6 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N2

  • Non-rep Peak Rev Power Dis-Max:

    30 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S6M4SL,L3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • Toshiba recommends soldering at a temperature of 260°C (500°F) for 10 seconds or less, with a peak temperature of 240°C (464°F) to prevent damage to the device.
  • While the device is designed to operate in a variety of environments, it is recommended to take precautions to prevent moisture ingress. Apply a conformal coating or use a moisture-resistant package to ensure reliable operation in high-humidity environments.
  • Store the device in a dry, cool place away from direct sunlight. Avoid storing the device in environments with high humidity or extreme temperatures.

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DF2S6M4SL,L3F Overview

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