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DF2S7MSL,L3F - Toshiba

Description: 20V Clamp 3A (8/20µs) Ipp Tvs Diode Surface Mount SL2 0.5pF @ 1MHz 20V

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Symbol
DF2S7MSL,L3F - Toshiba - PCB symbol
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PCB Footprints
DF2S7MSL,L3F - Toshiba PCB footprint - Other - Other - 1-1AL1A_2025-1.1
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3D Models
DF2S7MSL,L3F - Toshiba - 3D model - Other - 1-1AL1A_2025-1.1
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DF2S7MSL,L3F Details

  • Manufacturer Part Number:

    DF2S7MSL,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    10 V

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    8 V

  • Clamping Voltage-Max:

    20 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N2

  • Non-rep Peak Rev Power Dis-Max:

    60 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2,4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S7MSL,L3F Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Implement a heat sink or a thermal management system to keep the junction temperature below 150°C. Ensure good airflow and avoid blocking airflow around the device.
  • Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures.
  • While the DF2S7MSL,L3F is a high-quality device, it may not meet the specific requirements for high-reliability or aerospace applications. Consult with Toshiba or a qualified representative to determine suitability.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal management, and power supply quality. Use oscilloscopes and logic analyzers to diagnose issues.

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DF2S7MSL,L3F Overview

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