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DF2S8.2ASL,L3F - Toshiba

Description: ESD Suppressors / TVS Diodes ESD Protection Diode

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Symbol
DF2S8.2ASL,L3F - Toshiba - PCB symbol
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PCB Footprints
DF2S8.2ASL,L3F - Toshiba PCB footprint - Other - Other - DF2S8.2ASL,L3F-3
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3D Models
DF2S8.2ASL,L3F - Toshiba - 3D model - Other - DF2S8.2ASL,L3F-3
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DF2S8.2ASL,L3F Details

  • Manufacturer Part Number:

    DF2S8.2ASL,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    8.7 V

  • Breakdown Voltage-Min:

    7.7 V

  • Breakdown Voltage-Nom:

    8.2 V

  • Clamping Voltage-Max:

    22 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N2

  • Non-rep Peak Rev Power Dis-Max:

    55 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    6.5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF2S8.2ASL,L3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the Toshiba application note for more details.
  • Ensure the device is operated within the recommended junction temperature (Tj) range. Implement a thermal management system, such as a heat sink or fan, to maintain a safe operating temperature. Monitor the device's thermal resistance (Rth) and adjust the system design accordingly.
  • Handle the device with anti-static wrist straps, mats, or bags to prevent electrostatic discharge (ESD). The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.
  • The DF2S8.2ASL,L3F is a commercial-grade device, not specifically designed for high-reliability or aerospace applications. For such applications, consider using a device with a higher reliability rating, such as a QML-V or ESCC-certified device.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 183°C 90s. Use a solder with a melting point above 217°C to ensure reliable joints.

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DF2S8.2ASL,L3F Overview

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