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DF3052BF25V - Renesas Electronics

Description: The H8/3052B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

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PCB Footprints
DF3052BF25V - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-100B
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DF3052BF25V - Renesas Electronics  - 3D model - Quad Flat Packages - FP-100B
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DF3052BF25V Details

  • Manufacturer Part Number:

    DF3052BF25V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FQFP

  • Package Description:

    14 X 14 MM, 3.05 MM HEIGHT, 0.50 MM, ROHS COMPLIANT, PLASTIC, FQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PRQP0100KA

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    16

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Number of I/O Lines:

    78

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    75 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    3.05 mm

  • Speed:

    25 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF3052BF25V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, ensure proper grounding and decoupling, and follow the recommended PCB layout guidelines. Also, consider using EMI filters and ferrite beads on I/O lines.
  • Use the built-in power-down modes, optimize clock frequencies, and minimize I/O activity during standby. Also, consider using a low-dropout regulator and optimizing the power supply design.
  • Perform functional testing, including boundary scan and JTAG testing. Validate the device's operation across the entire operating temperature range and ensure compliance with relevant industry standards.

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DF3052BF25V Overview

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