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DF3A5.6LFU,LF - Toshiba

Description: ESD Protection Diodes / TVS Diodes ESD Protection Diode Low Capacitance Typ ,SOT-323 ,2.0×2.1×0.9 ,+/-8 kv ,8 pf ,1 μA, 5.3v .

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Symbol
DF3A5.6LFU,LF - Toshiba - PCB symbol
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PCB Footprints
DF3A5.6LFU,LF - Toshiba PCB footprint - Other - Other - DF3A5.6LFU,LF-1
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3D Models
DF3A5.6LFU,LF - Toshiba - 3D model - Other - DF3A5.6LFU,LF-1
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DF3A5.6LFU,LF Details

  • Manufacturer Part Number:

    DF3A5.6LFU,LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Breakdown Voltage-Max:

    6 V

  • Breakdown Voltage-Min:

    5.3 V

  • Breakdown Voltage-Nom:

    5.6 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.1 W

  • Reference Standard:

    IEC 61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF3A5.6LFU,LF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DF3A5.6LFU,LF is a rectangle with dimensions of 1.7mm x 1.3mm, with a 0.5mm pitch. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Additionally, ensure good airflow around the device and avoid blocking the thermal pads.
  • The maximum operating temperature range for the DF3A5.6LFU,LF is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, the DF3A5.6LFU,LF is designed to withstand high-vibration environments. However, it's essential to ensure the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • The recommended soldering profile for the DF3A5.6LFU,LF is a peak temperature of 260°C, with a dwell time of 30-60 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.

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DF3A5.6LFU,LF Overview

Use the download button to access the DF3A5.6LFU,LF schematic symbol, PCB footprint, and 3D model.
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