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DF3D18FU,LXHF - Toshiba

Description: 33V Clamp 2.5A (8/20µs) Ipp Tvs Diode Surface Mount USM

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Symbol
DF3D18FU,LXHF - Toshiba - PCB symbol
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PCB Footprints
DF3D18FU,LXHF - Toshiba PCB footprint - Other - Other - 1-2P1S_2025-9
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3D Models
DF3D18FU,LXHF - Toshiba - 3D model - Other - 1-2P1S_2025-9
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DF3D18FU,LXHF Details

  • Manufacturer Part Number:

    DF3D18FU,LXHF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    36 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Breakdown Voltage-Max:

    20.5 V

  • Breakdown Voltage-Min:

    16.2 V

  • Breakdown Voltage-Nom:

    18.35 V

  • Clamping Voltage-Max:

    33 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Non-rep Peak Rev Power Dis-Max:

    80 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-5; ISO 10605

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DF3D18FU,LXHF Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern is suggested.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • Handle the device with ESD-protective materials, such as wrist straps, mats, and bags. Store the device in a dry, ESD-protected environment, and avoid touching the pins or leads.
  • Yes, but ensure you follow the recommended qualification and testing procedures for high-reliability or automotive applications, as specified in the relevant industry standards (e.g., AEC-Q100).
  • Consult the datasheet and application notes for troubleshooting guidelines. If issues persist, contact Toshiba's technical support or a local authorized distributor for assistance.

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DF3D18FU,LXHF Overview

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