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DFB2060 - onsemi

Description: UL Certificate # E326243; Ideal for Printed Circuit Board; Glass Passivated Junction; Plastic Material has Underwriters Laboratory Flammability Classification 94V-0; Surge Overload Rating to 250 Amperes Peak; Isolated Voltage from Case to Lead Over 2500 Volts; High Case Dielectric Strength of 2000 VRMS; Reliable Low Cost Construction

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PCB Footprints
DFB2060 - onsemi PCB footprint - Other - Other - DFB2060-2
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3D Models
DFB2060 - onsemi  - 3D model - Other - DFB2060-2
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DFB2060 Details

  • Manufacturer Part Number:

    DFB2060

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP-4

  • Package Description:

    TS-6P, 4 PIN

  • Manufacturer Package Code:

    127EP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DFB2060 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the DFB2060, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal contact between the device and the heat sink. Additionally, consider using a thermal interface material to reduce thermal resistance.
  • The maximum allowed voltage on the enable pin is 6V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the DFB2060 is suitable for high-frequency switching applications up to 1 MHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's requirements are within the device's capabilities.
  • To handle the inrush current during startup, consider using a soft-start circuit or a current limiter to reduce the inrush current. Additionally, ensure that the power supply can handle the inrush current and that the device is properly bypassed.

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DFB2060 Overview

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