The recommended PCB footprint for the DFL1506S-E3/45 is a rectangular pad with a size of 1.5 mm x 0.6 mm, with a 0.3 mm x 0.3 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined area of 0.5 mm x 0.5 mm around the thermal pad.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a reflow oven with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. Avoid using excessive solder paste or flux, as it can cause solder bridging or other defects.
The maximum allowed voltage derating for the DFL1506S-E3/45 is 80% of the rated voltage. For example, if the rated voltage is 45 V, the maximum allowed voltage derating would be 36 V.
Handle the DFL1506S-E3/45 with care to avoid mechanical stress, bending, or twisting. Store the devices in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the devices to temperatures above 30°C or humidity above 60% during storage and shipping.
The recommended TIM for the DFL1506S-E3/45 is a thermal grease or thermal tape with a thermal conductivity of at least 1 W/m-K. Apply a thin, even layer of TIM to the thermal pad of the device, and ensure good contact between the device and the heat sink or PCB.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
DFL1506S-E3/45 Overview
Use the download button to access the DFL1506S-E3/45 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DFL15,
or try a keyword search, such as Bridge Rectifier Diodes
