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DFLZ22-TP - MCC

Description: Zener Diodes

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DFLZ22-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL  1e4t5
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DFLZ22-TP - MCC  - 3D model - Small Outline Diode Flat Lead - SOD-123FL  1e4t5
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DFLZ22-TP Details

  • Manufacturer Part Number:

    DFLZ22-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    15 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    22 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    25 mA

DFLZ22-TP Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for DFLZ22-TP is -40°C to 125°C.
  • Yes, the DFLZ22-TP is compatible with lead-free soldering processes, making it suitable for RoHS-compliant designs.
  • The maximum power dissipation of the DFLZ22-TP is 1.5 watts, making it suitable for low-power applications.
  • Yes, the DFLZ22-TP is designed for high-reliability applications, with a low failure rate and high MTBF (Mean Time Between Failures).
  • Yes, the DFLZ22-TP is available in tape and reel packaging, making it suitable for automated assembly and high-volume production.

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DFLZ22-TP Overview

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