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DFLZ33-7 - Diodes Incorporated

Description: Zener Diode 33 V 1 W ±6% Surface Mount PowerDI™ 123

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DFLZ33-7 - Diodes Incorporated PCB footprint - Other - Other - DFLZ33-7
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DFLZ33-7 - Diodes Incorporated  - 3D model - Other - DFLZ33-7
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DFLZ33-7 Details

  • Manufacturer Part Number:

    DFLZ33-7

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Manufacturer Package Code:

    POWERDI 123

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    5 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    33 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.06%

  • Working Test Current:

    25 mA

DFLZ33-7 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the package, and to connect it to a large copper area on the PCB. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using a heat sink or thermal management system to keep the device within its specified temperature range.
  • The DFLZ33-7 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within its specified voltage and current ranges, and avoid voltage spikes or transients that can trigger latch-up.
  • Yes, the DFLZ33-7 is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, which ensures its reliability and performance in harsh environments.
  • To prevent damage, store the DFLZ33-7 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the device by the body, avoiding touching the pins or electrical connections to prevent ESD damage.

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DFLZ33-7 Overview

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