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DFLZ6V8-TP - MCC

Description: Zener Diode 6.8 V 1 W ±6% Surface Mount SOD-123FL

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PCB Footprints
DFLZ6V8-TP - MCC PCB footprint - Other - Other - SOD-123FL_2023
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3D Models
DFLZ6V8-TP - MCC  - 3D model - Other - SOD-123FL_2023
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DFLZ6V8-TP Details

  • Manufacturer Part Number:

    DFLZ6V8-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    3 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    100 mA

DFLZ6V8-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the DFLZ6V8-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • The thermal pad on the DFLZ6V8-TP should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad with a diameter of at least 1.5mm is recommended.
  • The maximum operating temperature range for the DFLZ6V8-TP is -55°C to 150°C, with a storage temperature range of -65°C to 175°C.
  • Yes, the DFLZ6V8-TP is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality manufacturing process and rigorous testing procedures.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a solder paste with a melting point of 217°C to 221°C. The soldering time should not exceed 3 seconds.

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DFLZ6V8-TP Overview

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