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DG1408EEN-T1-GE4 - Vishay

Description: Multiplexer Switch ICs 8:1 MUX QFN 4x4mm

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DG1408EEN-T1-GE4 - Vishay PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN 4x4-16L Case Outline
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3D Models
DG1408EEN-T1-GE4 - Vishay  - 3D model - Quad Flat No-Lead - QFN 4x4-16L Case Outline
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DG1408EEN-T1-GE4 Details

  • Manufacturer Part Number:

    DG1408EEN-T1-GE4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.99

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    4 mm

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    58 dB

  • On-state Resistance Match-Nom:

    0.36 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    155 ns

  • Switch-on Time-Max:

    230 ns

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

DG1408EEN-T1-GE4 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG1408EEN-T1-GE4 is a standard QFN16 package with a 3x3 mm body size and 0.5 mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range of -40°C to 125°C, and consider using thermal management techniques such as heat sinks or thermal interfaces. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal resistance.
  • The DG1408EEN-T1-GE4 has an ESD protection level of ±2 kV human body model (HBM) and ±1 kV charged device model (CDM), which provides robust protection against electrostatic discharge events.
  • Yes, the DG1408EEN-T1-GE4 is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic capacitance, inductance, and resistance when designing the PCB layout and selecting components for high-frequency circuits.
  • The DG1408EEN-T1-GE4 requires proper power sequencing to prevent damage or malfunction. Ensure that the power supply voltage (VDD) is applied before the input signals, and that the power-down sequence is reversed. Consult the datasheet for specific power sequencing guidelines.

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DG1408EEN-T1-GE4 Overview

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